Hall B · Booth B401
Henkel is a leading global supplier of adhesives, sealants and functional coating technologies, with leading market positions in both industrial and consumer goods businesses. Rely…
COMPANY PROFILE
Henkel is a leading global supplier of adhesives, sealants and functional coating technologies, with leading market positions in both industrial and consumer goods businesses. Relying on its profound accumulation of materials science and global innovation network, Henkel continues to provide innovative solutions for industries such as electronics, automobiles, industrial manufacturing, and new energy. Its products and technologies cover key areas such as thermal conductive materials, functional electronic inks, circuit board protection, electronic packaging and reliable connections, and are committed to helping customers improve product performance, reliability and production efficiency.
MAIN PRODUCTS
Developed specifically for challenging designs in advanced computers, networking applications, and robotic computing platforms, this breakthrough, unreinforced, thermally conductive phase change material provides superior thermal conductivity. The material's thin bondline and low thermal resistance at very low pressures (35 psi) provide excellent thermal performance while minimizing stress.
BERGQUIST® GAP PAD TGP 7000ULM BLU is a gap filling material with a thermal conductivity of 7.5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material has excellent thermal properties at low pressures due to a unique filler package and ultra-low modulus resin formulation. BERGQUIST® GAP PAD TGP 7000ULM BLU is highly conformal to rough or irregular surfaces, allowing excellent wetting at the interface. Protective lining on both sides for ease of use.
BERGQUIST® GAP PAD TGP 5000 AP is a glass fiber reinforced filler and polymer with high thermal conductivity. The material is extremely soft while maintaining elasticity and consistency. Fiberglass reinforcement is easy to handle and convert, adds electrical isolation and tear resistance. The inherent natural tack on both sides aids application and allows the product to effectively fill air gaps, improving overall thermal performance. The top reduces stickiness for easier handling.
BERGQUIST® TGR 4000EI is a thermally conductive interface material based on silicone systems for electronics cooling applications. Other high power density applications will benefit from the extremely low thermal impedance. It is also designed for stencil printing or dispensing on IGBT applications.
BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications requiring minimal stress on components. The material's viscoelastic properties also provide excellent low-stress vibration damping and shock-absorbing properties. BERGQUIST GAP PAD TGP 1000VOUS is an electrical isolation material used in applications requiring isolation between water tanks and high voltage bare lead equipment.